美股詳情

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台積電

211.10

-4.3300-2.01%

盤後：210.83-0.2700-0.13%19:59 EDT

成交量：1,015.25萬

成交額：21.49億

市值：1.09萬億

市盈率：27.82

高：213.26

開：210.11

低：209.40

收：215.43

資料載入中...

總覽公司新聞公告

台積電6月13日成交額為21.48億美元

台積電下個廠去法國？總統馬克龍放話要生產2nm芯片

玻璃基板，陷入白熱化

半导体产业纵横

Intel也跪了，與蘋果爭奪臺積電2納米產能，將漲價五成以上

Ofweek光电信息网

消息稱臺積電第三代3nm製程工藝已在去年年底量產能滿足iPhone 17需求

臺積電熊本二廠2025年下半年動工，將導入6nm製程

集成80個HBM 4，臺積電封裝：瘋狂炫技

半导体行业观察

半導體巨頭，重塑供應鏈

半导体行业观察

臺積電美國晶圓廠建設加速，A16/N2芯片擬提前半年投產

臺積電準備新一代CoPoS封裝技術：最快2028年末量產，英偉達或是首個客戶

又要漲價了！曝驍龍8 Elite 3升級臺積電2nm：成本飆升

三星全力提升2奈米良率至50%，力求追趕臺積電

全球半导体观察

期權女巫 | 低估值芯片股正飛速超越英偉達！牛市看漲期權策略解析

臺積電與東京大學成立芯片研究實驗室

交銀國際：人工智能仍是未來一段時間最關鍵的技術變化市場關注或將重回應用落地變現

智通财经网

期權大單丨AI牛股Palantir股價再刷新高，看漲期權交投活躍；核電股Oklo單日暴漲近30%，Call單最高狂賺93倍

讓英偉達離不開，臺積電顛覆封裝？

半导体行业观察

美國人不讓建封裝廠，特朗普芯片計劃陷入困境

半导体行业观察

美國人不讓建封裝廠，特朗普芯片計劃陷入困境

半导体行业观察

格芯猛攻！臺積電受阻！晶圓代工戰火重燃！

芯界研习社

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17:56","pubTimestamp":1749808560,"startTime":"0","endTime":"0","summary":"Intel此前曾宣称它的A18工艺进展良好，预计年底量产，但是近期有消息指Intel也在争取台积电的2纳米工艺产能，这就意味着Intel的A18工艺可能再次遇到了量产困难。没有了竞争对手的台积电如今可谓志得意满，Intel、AMD、苹果、NVIDIA等诸多芯片企业都表达了希望获得台积电2纳米工艺产能，既然客户都在抢夺2纳米工艺，台积电将进一步提升2纳米工艺价格，预计将达到3万美元每片，比3纳米的2万美元每片提高五成。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250613180821951aea7f&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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11:00","pubTimestamp":1749783632,"startTime":"0","endTime":"0","summary":"台积电日本子公司总经理小野寺诚11日在横滨举行的技术论坛上表示，日本熊本二厂将于今年下半年动工，且2024年台积电在日本的营收超过40亿美元，占公司整体营收的4%。据悉，熊本二厂原定于2025年第一季度动工，但台积电在今年4月表示，考虑到对当地交通的影响，计划将开工时间推迟至今年内。小野寺诚此次确认熊本二厂将在今年下半年开始建设。据悉，熊本一厂已于2024年底开始量产，主要生产12至28nm成熟制程逻辑芯片。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250613110135951a66ee&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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4，臺積電封裝：瘋狂炫技","url":"https://stock-news.laohu8.com/highlight/detail?id=2543355521","media":"半导体行业观察","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2543355521?lang=zh_tw&edition=fundamental","pubTime":"2025-06-13 08:46","pubTimestamp":1749775615,"startTime":"0","endTime":"0","summary":"据悉，为了顺应AI半导体向更高性能和更大面积发展的趋势，台积电已设计出一款高达80 HBM4的产品。SoW-X是台积电计划于2027年量产的新一代封装技术，预计将应用于GPU、CPU等高性能系统半导体，以及整合HBM的AI半导体。根据台积电公布的数据，SoW-X集成了多达16个高性能计算芯片和80个HBM4模块。台积电评价SoW-X是超越业界标准的创新技术平台，并宣布将瞄准下一代高性能计算和AI产业。这是因为，尽管 HBM 负载高达 80%，但目前对超大容量 AI 半导体的需求有限。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250613085137a7064b74&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, 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16:29","pubTimestamp":1749716940,"startTime":"0","endTime":"0","summary":"据TECHPOWERUP报道，台积电正在准备新一代CoPoS 封装技术，可以将基板尺寸扩展到310 × 310 mm甚至更大。台积电计划2026年建造一条CoPoS试点生产线，2027年将重点改进工艺，以便满足合作伙伴的要求。台积电计划2028年年底至2029年年初实现CoPoS的量产工作，位于中国台湾嘉义的AP7工厂由于现代化的基础设施和宽敞的空间而被选中，成为CoPoS先进封装技术的生产中心。预计未来CoPoS将取代CoWoS-L，而英伟达很可能会是首个合作伙伴。","market":"sg","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/t/2025-06-12/doc-inezvcxy3617463.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["LU0234572021.USD","TWmain","LU1839511570.USD","LU1712237335.SGD","SNVD.UK","03145","LU2417539215.USD","2NVD.UK","IE00B5949003.HKD","LU2211815571.USD","NVD3.UK","LU1974910355.USD","TSM","LU1868838027.USD","NVD2.UK","NVDS","LU1037948541.HKD","NVD","LU0056508442.USD","LU1282649810.SGD","LU1868837722.USD","LU0689626769.HKD","LU2092937148.SGD","LU2452424414.USD","NVDD","NVDY","BK4551","EWT","LU2491049909.HKD","NVDS.UK","LU0965509283.SGD","IE00B3M56506.USD","3NVD.UK","BK4526","IE00BK4W5L77.USD","HK0000306685.HKD","LU0792757196.USD","LU0957791311.USD","LU1868836757.USD","NVDU","LU0097036916.USD","NVIW.SI","BK4612","NVDX","LU1035775433.USD","IE00BQXX3D17.EUR","SG9999015945.SGD","LU0096362180.USD"],"gpt_icon":1},{"id":"2542956768","title":"又要漲價了！曝驍龍8 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近日，Palantir宣布与领先的特种纸制造商Fedrigoni达成重要的多年合作伙伴关系。此协议凸显了Palantir在商业领域日益增长的吸引力。","market":"us","thumbnail":"https://static.tigerbbs.com/5d1fe578ee46cbe0d24c33435ff25ae5","type":0,"news_type":0,"thumbnails":["https://static.tigerbbs.com/5d1fe578ee46cbe0d24c33435ff25ae5"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":true,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["RGTI","PLTR","OKLO","BABA","TSM","QUBT"],"gpt_icon":1},{"id":"2542551567","title":"讓英偉達離不開，臺積電顛覆封裝？","url":"https://stock-news.laohu8.com/highlight/detail?id=2542551567","media":"半导体行业观察","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2542551567?lang=zh_tw&edition=fundamental","pubTime":"2025-06-12 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