Wolfspeed推出基于300毫米碳化硅技术的下一代AI数据中心先进封装基础架构

美股速递
Mar 10

Wolfspeed公司正式发布了其下一代人工智能数据中心先进封装的基础框架,该框架创新性地采用了300毫米碳化硅技术。

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