6月8日，台积电盘前上涨3.04%，报427.98美元/股，成交额3948.91万美元。
消息面上，台积电董事长兼总裁魏哲家在6月4日股东会上透露，基于玻璃基板的CoPoS（Chip-on-Panel-on-Substrate）先进封装技术已正式进入试点线运行阶段，预计2-3年内产能将显著提升。该技术采用方形玻璃面板替代传统硅中介层，旨在支持更大尺寸AI与HPC芯片封装需求，英伟达为首批客户。
市场认为这一进展标志着玻璃基板从概念验证迈入规模量产前夜，属0到1的产业拐点。当前英特尔、三星电机、SKC等厂商亦加速布局，行业预计2027年开始早期商业化，2028年进入加速渗透期。台积电同时重申全年营收增速超30%，AI芯片需求持续强劲。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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