8月4日，英特尔盘中上涨4.17%，报96.39美元/股，成交额9.02亿美元。
消息面上，英特尔EMIB-T先进封装技术良率已突破90%，预计明年开始量产；同时联发科首度公开确认其ASIC项目已采用英特尔EMIB-T封装技术。据披露，EMIB-T成本较台积电CoWoS方案低约50%，英特尔预计明年大规模提供该封装服务。联发科同时押注台积电CoWoS与英特尔EMIB-T两条路线，反映封装已成为AI芯片解决方案的核心竞争维度。此外，期权市场当日出现371万美元虚值Call买入押注向上突破，整体大单情绪偏多，呈现谨慎乐观格局。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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