AMD CEO:公司将于2027年推出搭载MI500 GPU、Verano CPU、Pensando网络及铜缆与光缆扩展域的机架级产品

美股速递
Aug 05

AMD首席执行官宣布,公司计划在2027年推出一款里程碑式的机架级产品。这款产品将集成MI500 GPU、Verano CPU以及Pensando网络技术,同时支持铜缆和光缆两种扩展域方案。这一举措标志着AMD在数据中心和AI计算领域迈出了关键一步。通过整合高性能计算、网络和存储资源,该产品旨在应对日益复杂的规模化工作负载需求。其设计兼顾了铜缆连接的经济性与光缆连接的高带宽优势,为用户提供灵活部署选项。AMD此次战略布局,有望进一步巩固其在竞争激烈的半导体市场中的技术领先地位。

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