半导体材料生产商天岳先进（02631.HK）今日在港交所挂牌上市，截至盘中，股价大涨8.88%，引发市场广泛关注。
天岳先进此次全球发售4774.57万股H股，最终定价为每股42.8港元，处于招股价格区间的上限。公司公开发售部分获得热烈响应，录得2809.19倍超额认购，显示投资者对公司前景充满信心。国际配售部分同样表现强劲，获得9.04倍超额认购。公司通过此次IPO共筹集约19.38亿港元净额。
作为全球排名前三的碳化硅衬底制造商，天岳先进在宽禁带半导体材料领域具有领先地位。公司产品广泛应用于电动汽车、人工智能数据中心、光伏系统等新兴领域，市场前景广阔。投资者对公司的热捧反映了市场对高科技半导体材料行业的看好，以及对天岳先进技术实力和增长潜力的认可。此次成功上市不仅为公司提供了充足的资金支持，也进一步提升了其在国际市场的影响力。
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