8月10日，ASMPT盘中上涨3.09%，报166.6港元，成交额3.0亿港元，前期获利回吐压力有所消化后股价重拾升势。
消息面上，半导体设备板块本周集体反弹，机构指出强劲业绩支撑板块进入修复通道，看好下半年先进封装行情。此外，贝莱德近日将ASMPT多头持仓比例增至5.18%，外资持续加仓信号明确。基本面上，ASMPT二季度经调整纯利6.38亿港元，超市场预期76%，订单出货比1.43倍创五年新高，花旗、摩根大通、美银等多家大行维持买入评级，目标价最高达310港元，当前股价距主流目标价仍有较大上行空间。日本8月1日落地的第三轮半导体出口管制亦强化先进封装设备全球供需紧张预期。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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