此外,RBC Capital Markets此前指出公司电子材料业务有望受益于先进半导体节点和AI驱动需求,并维持“跑赢大市”评级。公司近期还与Imec及特拉华大学建立合作,并推出先进封装平台和新型热管理材料,持续强化半导体材料领域布局,进一步提振了市场信心。
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