According to the latest SEMI 300mm Fab Outlook Report, global equipment investment for 300mm wafer fabrication in the memory sector is projected to surpass $50 billion for the first time in 2026, rising 29% to $52 billion. A further 11% increase to $57 billion is anticipated in 2027.

This growth, underpinned by increased investment in AI infrastructure, data centers, and next-generation computing systems, reflects the sustained, AI-driven demand for advanced memory. Looking ahead, SEMI forecasts that global 300mm fab equipment investment for memory will grow at a compound annual growth rate (CAGR) of 19% from 2024 to 2029.

Global 300mm memory capacity is also expected to continue expanding, reaching 4.1 million wafers per month in 2026 and 4.2 million wafers per month in 2027. Furthermore, SEMI has revised its 300mm fab equipment investment forecast for the memory sector upward, primarily driven by ongoing increases in capital expenditure plans from leading cloud service providers and robust demand for AI accelerators.

Bolstered by strong demand for HBM and DDR5 memory from GPUs and other AI accelerators, DRAM equipment spending is forecast to grow 29% to $37 billion in 2026. Similarly, supported by rising data storage needs from AI deployments, 3D NAND equipment spending is projected to increase 28% to $14 billion in 2026.

Continued investment in advanced-node DRAM and higher-layer-count 3D NAND supports a more optimistic outlook for memory capacity. However, effective capacity growth is expected to remain moderate due to technology transitions and process complexities, including the shift to advanced-node DRAM, HBM, and higher-layer NAND.