苹果联手凌云半导体与GLOBALFOUNDRIES,于纽约工厂共建先进半导体工艺技术

美股速递
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科技巨头苹果公司正携手音频芯片制造商凌云半导体以及半导体代工厂GLOBALFOUNDRIES Inc.,计划在GLOBALFOUNDRIES位于纽约的工厂内共同开发先进的半导体工艺技术。此项合作旨在强化供应链并推动芯片制造创新。

此次三方合作将整合各自的专业优势。苹果公司在消费电子领域的深厚积淀、凌云半导体在模拟与混合信号芯片方面的专长,以及GLOBALFOUNDRIES的先进制造能力,将汇聚于纽约的半导体制造中心。此举不仅有望提升未来苹果设备的芯片性能,也标志着对在美国本土建立更强大、更具韧性的半导体生态系统的共同承诺。

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