6月10日，广合科技盘中下跌3.68%，报176.0港元/股，成交额3438.05万港元。消息面上，该股前一交易日在PCB产业链集体走强背景下大涨超10%，今日出现获利回吐压力。
行业层面，覆铜板厂商自6月初起陆续发出三季度涨价通知，提价幅度普遍在10%至15%之间，上游原材料持续涨价对下游PCB制造商的成本传导能力及盈利前景构成压制。当日行业内上游建滔集团涨0.67%，而下游胜宏科技跌2.52%、鸿腾精密跌8.46%，上下游分化格局延续。此外，公司15.44万股激励限售股将于6月15日解禁上市，虽占总股本仅0.03%，但短期对市场情绪形成一定扰动。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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