Shanghai Lang Silicon Technology Co., Ltd. (hereinafter referred to as "Lang Silicon Tech" or "the Company") has officially completed a nearly RMB 200 million Pre-A+ round of financing. A total of seven institutions participated in this round, including Hillhouse Ventures, Zhiwei Capital, SenseTime Guoxiang Capital, Jiayi Venture Capital, Feitu Venture Capital, and Zhongqi Capital, with existing shareholder Dongfang Fuhai also increasing its investment. It is understood that the funds raised in this round will primarily be used to increase investment in the research and development of the advanced packaging device chip-based platform for silicon capacitors, silicon resistors, and silicon inductors, expand the core team, and procure key equipment, further advancing the path toward mass production and delivery of its products.

Industry Collaboration Upstream: Billion-Yuan Orders Secured in the CPU/GPU Sector

Founded in September 2022, Lang Silicon Tech focuses on the development and industrialization of silicon-based passive devices. Its core products include silicon capacitors, silicon resistors, and silicon inductors, targeting markets such as AI processors, high-performance computing, high-speed optical modules, and server power supplies. As AI large models and high-performance computing continue to push chip power consumption higher, the demands on power delivery networks (PDN) for transient response, low impedance, and miniaturization are steadily increasing. Silicon capacitors, with their ultra-low equivalent series resistance (ESR), equivalent series inductance (ESL), stability across wide temperature ranges, and ultra-thin integration capabilities, are rapidly entering advanced packaging systems for GPUs, CPUs, and SoCs, becoming a key component for high-frequency decoupling near the chip.

Against this backdrop, Lang Silicon Tech has developed two core product paths targeting different packaging architectures: surface-mount silicon capacitors and substrate-embedded capacitors. Both solutions have already passed customer validation. Surface-mount silicon capacitors can flexibly adapt to high-density decoupling needs both inside and outside the package, while multi-terminal substrate-embedded capacitors are designed for integration within the packaging substrate. Currently, the Company has expanded from single-device development to multiple advanced packaging application scenarios. It works closely with several wafer fabs, packaging houses, and substrate manufacturers, establishing a dual-supply-chain strategy with a monthly production capacity exceeding 500 million units, laying a solid foundation for large-scale manufacturing. On the commercialization front, its multi-terminal substrate-embedded capacitor products have achieved scaled deliveries in the CPU and GPU sectors, securing orders worth over RMB 100 million. In the optical module sector, it has begun bulk shipping to leading overseas customers. The Company now counts more than 20 customers with products in mass production or under validation, and its product matrix, focused on the deep integration of advanced packaging and PDN, continues to expand. To facilitate product adoption, Lang Silicon Tech integrates industry collaboration upfront at the product definition and development stages. It conducts joint development with multiple customers, packaging houses, and substrate manufacturers, focusing on dimensions, parameters, terminal structures, and reliability requirements, continuously smoothing the critical path from device design and process adaptation to packaging integration.

Platform Strategy Takes Shape: Over 200 Mass-Production Models Covering Diverse Scenarios

Lang Silicon Tech's strategy extends beyond just silicon capacitor devices. The Company is systematically building out three major product lines—silicon capacitors, silicon resistors, and silicon inductors—covering requirements for filtering, decoupling, impedance matching, and power management, forming a silicon-based passive device platform that is combinable, customizable, and co-verifiable. Currently, the Company has over 200 mass-production models across its silicon capacitor and silicon resistor series, while continuing to advance the development of silicon-based power inductors and its 2.5D/3D integration roadmap. To date, Lang Silicon Tech has accumulated 34 core patents and layout designs. In 2024, it was approved for the Shanghai Municipal Leading Industry Project for Integrated Circuits; in 2025, it won first prize at the "Innovate in Shanghai" International Innovation and Entrepreneurship Competition; and in May 2026, its product featuring a capacitance density of 2μF/mm² and ESL below 2.9pH passed AEC-Q200 automotive-grade reliability certification. The Company has stated that it will continue to increase investment in the research and industrialization of silicon-based passive devices, focusing on the deep integration of advanced packaging and PDN, and leveraging a platform-based approach to connect devices, packaging, and systems, providing foundational technology support for AI computing power and high-speed interconnect.