两家企业正致力于探索覆盖硅片、机架、系统及应用程序等各层级的全面人工智能解决方案。这一举措旨在构建从底层硬件到顶层软件应用的完整AI技术栈，提供端到端的集成服务。通过整合不同层面的技术与资源，合作双方期望能更高效地应对复杂的人工智能计算需求，并推动AI技术在实际业务场景中的深度落地与创新应用。
两家企业正致力于探索覆盖硅片、机架、系统及应用程序等各层级的全面人工智能解决方案。这一举措旨在构建从底层硬件到顶层软件应用的完整AI技术栈，提供端到端的集成服务。通过整合不同层面的技术与资源，合作双方期望能更高效地应对复杂的人工智能计算需求，并推动AI技术在实际业务场景中的深度落地与创新应用。
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