10月2日，高通盘中上涨3.01%，报187.155美元/股，成交额2.52亿美元。
消息面上，半导体板块整体回暖，高通领涨逾4%，英伟达、台积电等同步走强。此前高通因芯片股集体遭抛售一度重挫近7%，当前反弹受多重利好支撑：一方面，高通与苹果正式续签全球专利许可协议，新协议自明年4月生效，确认即使苹果全面切换自研基带，仍需持续支付专利授权费用，巩固了高通专利授权业务的长期确定性；另一方面，高通在骁龙峰会上推出采用台积电2nm工艺的第六代骁龙8系列旗舰芯片，小米、荣耀等中国厂商已列入首批采用名单。此外，台积电因客户订单增加10%至20%加速扩产2nm产能，高通作为主要客户之一有望受益。期权市场近期大单情绪也明显偏多，多笔看涨组合策略显示机构资金看好中期上行空间。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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