异动解读|日月光半导体盘中上涨3.17%,先进封装板块情绪回暖

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10月9日,日月光半导体盘中上涨3.17%,报46.47美元/股,成交额1495.0万美元。

消息面上,此前日月光投控获得Google TPU与英特尔追加先进封测订单的消息持续发酵,市场对其在AI先进封装领域的接单能力保持关注。结合Counterpoint Research最新报告,全球晶圆代工2.0市场第二季度营收同比增长25%,先进封装成为关注焦点,为日月光股价提供支撑。

日月光半导体所在半导体产品行业中,整体表现回暖,个股中,博通涨1.50%,美光科技涨0.93%,英伟达涨0.63%,美国超微公司涨0.39%,英特尔涨0.21%。

(以上内容均基于市场公开消息,由程序或算法智能生成,仅作为股价异动提醒,不作为投资建议或交易依据。)

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