赛晶科技子公司及多方签署投资合作协议,拟组建公司开发TPU AI芯片

投资观察
Sep 09

9月9日(路透社)——赛晶科技集团有限公司(0580.HK)今日公告,旗下嘉善赛晶、赛晶半导体等主体已与多方共同签署投资合作协议。

根据协议内容,各方将携手成立一家合资公司,注册资本设定为2000万元人民币。该合资公司未来将专注于TPU人工智能芯片的研发、生产及销售业务,旨在进一步拓展半导体领域布局。

赛晶科技此次动作,无疑为其技术版图增添了新的战略支点。公告并未透露更多交易细节,但这一合作动向已引发市场关注。

更多相关资讯,可持续关注0580.HK的公司公告。

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