On May 26, the China Information Technology Security Evaluation Center and the National Secrecy Technology Evaluation Center jointly released the "Security and Reliability Evaluation Results Announcement (No. 2, 2026)." For the first time, AI training and inference chips were included in this evaluation system. Biren Technology's Bili™ 166, along with eight other domestic chips, received the Security and Reliability Level I certification. According to reports, the Bili™ 166M product is a 4U OAM V1.1 air-cooled module with a peak power consumption of 550W. It is compatible with standard OAM V1.X version GPU servers, offering high compatibility with existing infrastructure, and is suitable for a wide range of artificial intelligence training and inference application scenarios. It has been noted that the national evaluation results serve as a critical reference threshold for information technology innovation selection in key sectors such as government procurement, finance, and energy. This indicates that the relevant products have obtained a compliance "pass" for broader industry deployment, rather than merely a technical certification. Recently, following the Hang Seng Indexes Company's quarterly review, Biren Technology has been included in the Hang Seng Composite Index. The changes will take effect after the market close on June 5 and be implemented starting June 8. The market anticipates that the company may simultaneously be added to the Stock Connect Southbound eligible securities list, potentially opening up new channels for incremental southbound capital. At the market open on May 27, Biren Technology's stock rose over 1.66%, trading at HKD 52 per share.