10月12日，日月光半导体夜盘上涨3.02%，报47.66美元/股，成交额51.58万美元。本次异动延续了近期市场对先进封装领域的关注情绪，Counterpoint Research报告显示全球晶圆代工2.0市场第二季度营收同比增长25%，先进封装成为核心焦点，为日月光半导体股价提供支撑。
此前日月光投控获得Google TPU与英特尔追加先进封测订单的消息持续发酵，Google TPU预计2028年进入大规模放量阶段，出货量上看1200万至1500万颗，英特尔亦加快推进EMIB先进封装平台并扩大委外释单，日月光可直接承接后段晶圆级组装与高阶测试业务。先进封装已从芯片后端工序升级为决定AI芯片算力与带宽的核心环节，封测企业在AI算力价值链中的地位持续抬升。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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