At the 2026 Beijing Auto Show, Ouye Semiconductor showcased its full-stack solution for smart vehicles based on a "central + zonal" architecture, alongside demonstrations of its applications in robotics, smart industrial systems, and the broader AIoT sector.
At the central computing level, Ouye Semiconductor, in collaboration with Freetech and Unisoc, launched the "Fuxin No.1," an affordable 5G integrated cockpit and driving-parking solution. This marks the industry's first solution to deeply integrate algorithms, chips, and communication capabilities. Utilizing a dual-chip, loosely coupled architecture, it reduces space requirements by 60%, cuts costs by 30%, and shortens development cycles by two to four months. The entire supply chain—from chips and algorithms to communications—is independently controllable, achieving a 100% localization rate. Functionally, "Fuxin No.1" supports HNOA high-speed navigation assisted driving, AEB+AES dual safety protection, APA+RPA all-scenario parking, and IMS+SR human-machine co-driving cockpit experiences, highlighting its integrated cockpit and driving capabilities.
The event also featured the "Fuxing" series solution, developed jointly by Ouye and Freetech. This series covers key application scenarios from L2-level assisted driving to integrated driving and parking, emphasizing high cost-effectiveness, maturity, reliability, and rapid deployment to facilitate the large-scale adoption of assisted intelligent driving.
At the zonal level, Ouye Semiconductor introduced the Gongbu 565 series chips, filling a gap in the domestic high-end Zonal Control Unit (ZCU) market. The Gongbu 565 brings two major breakthroughs. First, it pioneers the application of RRAM technology in domestic automotive-grade MCUs: compared to traditional eFlash, RRAM reduces write latency by 1000 times and increases read speed by 100%. Second, it features a built-in AI acceleration engine, delivering 0.5 TOPS of computing power. This enables the zonal controller to function as an intelligent zonal agent, reducing end-to-end latency by over 70% compared to traditional MCU solutions.
On the endpoint device side, Ouye Semiconductor partnered with Ande Jia to launch an LBS laser projection headlight solution. This solution offers a smaller form factor and lower cost compared to the currently mainstream DLP technology, making it more suitable for large-scale adoption.
In the smart vehicle sector, Ouye Semiconductor has secured dozens of project design-wins from multiple leading automakers for its assisted intelligent driving systems, intelligent zonal processors, and smart endpoint components, with products gradually entering mass production and vehicle integration. Ouye Semiconductor founder Zhou Difei stated, "Through these efforts, we hope to make vehicle intelligence not a distant concept, but safety, convenience, and enjoyment within reach for every driver."