高塔半导体(TSEM)今日盘中大涨5.04%，引起了市场的广泛关注。
消息面上，公司宣布将投资约30亿美元扩建其位于日本的300毫米晶圆制造厂，以大幅提升硅光子、硅锗及先进封装产能。该计划获得了日本政府约10亿美元的补助支持。作为扩产计划的一部分，高塔半导体同时上调了其2028年的财务目标，预计营收将达到36亿美元，营业利润将达到12亿美元，显著高于此前的业绩指引。
此次扩产旨在满足人工智能和数据中心应用对光互连技术日益增长的需求。分析指出，随着AI算力需求激增，硅光子技术对于解决数据中心内部高速数据传输瓶颈至关重要，高塔半导体在此领域的产能扩张有望使其成为AI基础设施供应链中的关键参与者，从而打开了未来的增长空间，增强了投资者信心。
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