5月26日，日月光半导体盘中上涨9.08%，报38.23美元/股，成交额4153.31万美元。
消息面上，AMD宣布向中国台湾地区半导体与AI产业生态圈投入超100亿美元，日月光作为核心封测合作伙伴，将与AMD共同开发下一代2.5D桥接互连技术，直接受益于产能扩充与订单预期。同时，日月光子公司宣布推出自动化310mm面板级封装产线，预计将于明年上半年投产，进一步打开先进封装增长空间。此外，公司此前因董事抛售叠加板块走弱累计跌幅曾超15%，当前基本面稳健，封测服务涨价5%至20%，先进封装营收目标上调至35亿美元，前期超跌后技术性反弹延续。板块方面，美光科技涨11.85%、迈威尔科技涨9.78%，行业情绪回暖共振。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.