6月24日，日月光半导体盘中上涨3.53%，报40.51美元/股，成交额5597.24万美元。
消息面上，日月光在股东大会后披露大规模扩产计划：集团本体规划6座新厂，旗下矽品精密同步布局7座新厂，叠加收购改造项目合计约15个新建扩建项目。同时公司披露美国扩张计划，在加州已有两座测试厂基础上拟再新建两座工厂，并评估亚利桑那投资。此外，公司确认扇出面板级封装（FOPLP）首座全自动化量产产线计划年底投产，CEO吴田玉表示下半年业绩有望超预期，并指出许多客户正跟随英伟达和AMD在台湾地区扩大投资。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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