日月光半导体今日盘中股价大幅上涨5.03%，市场表现强劲。
消息面上，公司近期在季度财报电话会议上预测，其先进封装业务规模将在2026年翻倍至32亿美元。同时，公司公布的第四季度财务数据显示营收同比增长9.6%，净利润增幅高达58%，业绩表现亮眼。此外，公司宣布计划在今年增加15亿美元的机械设备资本支出，以支持未来增长。
另一方面，有报道指出日月光正在高雄建造其首条“类CoWoS-L”先进封装产线，目前正与博通、AMD等潜在客户进行验证，目标在2027年实现量产。市场认为，公司在AI与先进封装领域的积极布局和明确增长蓝图，是推动股价上涨的主要动力。
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