建滔积层板今日盘中大涨5.75%，引起了市场的广泛关注。
消息面上，行业正迎来新一轮覆铜板涨价潮。受下游需求攀升及原材料价格上涨影响，建滔积层板等企业已陆续启动涨价。继日本半导体材料巨头Resonac及三菱瓦斯化学宣布对相关产品大幅提价后，建滔积层板近日亦宣布将所有板料及半固化片价格上调10%。
此外，AI产业的强劲需求被视为推动此轮行情的重要动力。分析指出，AI短期及中期需求均非常强劲，带动了PCB（印制电路板）的价量齐升。目前多家AI-PCB公司订单饱满，正在大力扩产。由于海外覆铜板产能扩张缓慢，作为大陆覆铜板龙头厂商的建滔积层板有望从中显著受益。
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