PCB印刷电路板企业广合科技今日至下星期二招股，全球公开发售4600万H股，10%在港公开发售，其余国际配售。
每手100股，每股发售价不超过71.88港元，入场费7260.49港元。
集资最多近33.1亿元，近20%所得款项净额将用于泰国基地二期；约52%用于扩建及升级广州基地的生产设施；约10%升开发材料技术、改良生产工艺及产品开发方面的研发能力；逾8%将用于战略合作、投资或收购项目；约10%将用作营运资金及一般企业用途。
公司主要从事研发、生产及销售应用于算力服务器，及其他算力场景的定制化印刷电路板。
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