5月20日，芯片制造设备巨头阿斯麦CEO表示，在可预见的未来，蓬勃发展的全球半导体市场将面临“紧张”局面，供应将持续趋紧，因为来自人工智能、卫星和机器人领域的需求已超过了行业的生产能力。他表示，芯片市场的供应链中可能会出现一些间歇性的瓶颈，预计到2030年，其市场规模可能达到1.5万亿美元。
阿斯麦CEO称：“对人工智能的需求如此强劲，以至于我们将在相当长一段时间内面临供应短缺的局面。”他提到像埃隆·马斯克提出的庞大“TeraFab”人工智能计划以及星链卫星这样的项目，可能会推动新一轮的需求增长。他还称，阿斯麦正在努力提高产量并提升其设备的生产效率，以跟上形势的发展，同时新的技术也在不断涌现。但他也提醒说，这种增长的规模难以预测，可能会超出行业规划的范围。
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