印度政府、奥里萨邦政府、英特尔与3Dgs Inc. USA签署基板制造谅解备忘录,预估投资额达33亿美元

美股速递
May 29

印度政府、奥里萨邦政府、美国芯片巨头英特尔以及3Dgs Inc. USA共同签署了一份关于基板制造的谅解备忘录。据估计,该项目总投资额高达33亿美元。这一合作旨在加强印度在半导体供应链关键环节的制造能力,标志着印度在吸引高科技制造业投资方面取得重要进展。

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