8月11日，应用材料盘前上涨3.42%，报538.26美元/股，成交额3531.43万美元。
消息面上，Bernstein将应用材料目标价从525美元大幅上调至675美元，维持跑赢大盘评级；此前RBC Capital Markets发布研报称，应用材料第三财季有望超预期并上调全年系统业务展望，预计调整后每股收益3.36美元、营收89亿美元，看好其在NAND复苏及ICAPS业务稳定下的增长前景。此外，公司宣布与UC Berkeley在EPIC中心达成半导体研究合作，进一步强化先进工艺整合能力。应用材料将于8月13日发布财报，当前股价与机构平均目标价646美元仍存约20%折价空间，半导体设备板块整体偏强，阿斯麦涨3.41%、拉姆研究涨3.12%、科磊涨2.9%。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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