8月18日，晶合集成盘中下跌3.43%，报35.44港元/股，成交额7781.25万港元。
消息面上，日本经济产业省第三轮半导体出口管制新规于8月16日全面落地执行，针对光刻混合气、蚀刻沉积高纯氟化物等20大类高端电子特气实施对华逐案单独许可，审批周期拉长至4至6个月，头部晶圆厂被列入重点审查清单，直接冲击国内晶圆制造供应链。晶合集成作为12英寸晶圆代工企业，特气为生产核心耗材，管制落地加剧市场对供应链成本及交付周期的担忧。板块方面，半导体产品行业当日整体走弱，华虹宏力跌4.65%、兆易创新跌5.32%、澜起科技跌6.37%，行业共振回调拖累股价。此外，公司A股前一交易日大涨8.76%后短期获利回吐压力亦有所释放。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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