On June 15, ASMPT rose 6.56% in regular trading, trading at 189.0 HKD/share, with turnover of 68.42 million HKD. The stock continued its rebound momentum driven by a major order win and favorable industry dynamics.

On the news front, ASMPT recently announced it has secured an additional order from a global leading Integrated Device Manufacturer (IDM) to supply eight Thermocompression Bonding (TCB) systems for chip-to-wafer applications, supporting production of advanced client and data center CPUs as chiplet-based architectures gain wider adoption. Institutional research estimates that under full production conditions, global HBM production will require 532, 648, and 748 new TCB units from 2026 to 2028 respectively, positioning ASMPT as a core beneficiary as global memory giants accelerate capacity expansion.

Additionally, institutions noted that China mainland CSP capital expenditure has further upward revision potential, with the semiconductor equipment sector maintaining high prosperity through the second half, providing sector-wide tailwinds to the stock's performance.

(The above content is based on publicly available market information, generated by a program or algorithm, and is intended solely as a stock movement alert. It does not constitute investment advice or a basis for trading decisions.)