Hkc Corporation Limited (001399.SZ) announced that on July 17, 2026, the company entered into a cooperation agreement with the Shaoxing Area Management Committee of the Hangzhou-Shaoxing Airport Economic Integration Demonstration Zone to develop the Hkc Advanced Packaging and Testing Project.

The company plans to invest 4 billion yuan to establish a wholly-owned subsidiary, Zhejiang Huixin Advanced Semiconductor Co., Ltd. (provisional name), to serve as the project implementation entity.

The project will be constructed in two phases. The first phase involves building a 12-inch mixed-chip advanced packaging and testing facility. Upon reaching full production capacity, it is expected to achieve a monthly output of 20 million units, with the construction period estimated not to exceed three years.

Against the backdrop of a global semiconductor industry supply chain restructuring and sustained growth in domestic chip packaging and testing demand, this investment marks the company's entry into the advanced packaging and testing sector.

This move represents a significant strategic step for the company to proactively extend into higher-value-added segments of the industrial chain. It is expected to foster new business growth drivers, optimize the industrial structure, and enhance the company's overall competitiveness and long-term profitability.