新思科技宣布与全球半导体制造巨头台积电建立深度合作伙伴关系，双方将共同为下一代人工智能系统提供关键技术支撑。此次合作聚焦于经过硅验证的知识产权（IP）解决方案和获得认证的电子设计自动化（EDA）流程，旨在加速高性能AI芯片的开发与量产进程。
通过整合新思科技先进的IP组合与台积电领先的制程技术，合作将显著提升AI芯片的设计效率和性能表现。双方联合优化的EDA流程已通过严格认证，可确保从设计到制造的完整链路实现无缝衔接，为复杂AI系统提供可靠的底层技术保障。
这一战略协作将推动AI芯片在算力、能效和集成度方面的突破性进展，为自动驾驶、大数据分析和边缘计算等前沿应用场景注入新动能。业界认为，此次强强联合有望重塑AI芯片产业生态，为下一代智能系统的创新发展奠定坚实基础。
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