5月27日，日月光半导体夜盘上涨3.98%，报40.5美元/股，成交额1.49万美元。
消息面上，AMD此前宣布向中国台湾地区半导体与AI产业生态投入超100亿美元，日月光作为核心封测合作伙伴，将与AMD共同开发下一代2.5D桥接互连技术，直接受益于产能扩充与订单预期。同时，日月光子公司推出自动化310mm面板级封装产线，预计明年上半年投产，进一步打开先进封装增长空间。当前公司基本面稳健，封测服务涨价5%至20%，先进封装营收目标上调至35亿美元。板块方面，美光科技涨4.23%、美国超微公司涨1.3%，行业情绪延续回暖。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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