6月30日，应用材料夜盘上涨5%，报729.47美元/股，成交额3382.04万美元。
消息面上，应用材料公开了面向AI半导体的三维（3D）芯片制造设备产品线，主要聚焦高带宽存储器（HBM）及芯粒等领域。同时，Susquehanna将应用材料目标价从575美元大幅上调至900美元，为目前华尔街最高目标价；此前一周内KeyBanc、杰富瑞、美银、富国银行、花旗等机构亦集中上调目标价至710-770美元区间，机构共振效应显著。基本面方面，韩国政府宣布约800万亿韩元半导体与AI产业投资计划，三星电子等将建设四座芯片工厂，大规模设备采购需求直接利好全球头部半导体设备商。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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