6月30日，港股半导体板块走强。 ASMPT升7%创新高，报232.2港元； 华虹宏力升1.67%，报207.6港元； 中芯国际升3.95%，报88.15港元； 晶门半导体升1.59%，报0.32港元，中电华大科技升0.97%。
半导体股今日继续走强，主要还是跟AI算力和国产芯片主线有关。AI服务器、数据中心建设带动先进封装和晶圆制造需求，ASMPT这类封装设备股率先走高；华虹宏力、中芯国际也跟随晶圆代工涨价预期上涨。
6月30日，港股半导体板块走强。 ASMPT升7%创新高，报232.2港元； 华虹宏力升1.67%，报207.6港元； 中芯国际升3.95%，报88.15港元； 晶门半导体升1.59%，报0.32港元，中电华大科技升0.97%。
半导体股今日继续走强，主要还是跟AI算力和国产芯片主线有关。AI服务器、数据中心建设带动先进封装和晶圆制造需求，ASMPT这类封装设备股率先走高；华虹宏力、中芯国际也跟随晶圆代工涨价预期上涨。
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