英伟达CEO宣布与台积电合作 Spectrum X芯片共封装光学芯片已全面投产

美股速递
Mar 17

英伟达首席执行官透露,公司已携手台积电启动针对Spectrum X芯片的共封装光学芯片全面量产计划。这一技术突破标志着高性能计算与光通信融合迈入新阶段,将为下一代数据中心基础设施提供关键支持。

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