据知情人士透露,中国已制定明确目标,计划到2030年实现新增50万片晶圆月产能的扩张计划。这一战略部署将显著提升国内半导体制造能力,为产业链自主可控奠定坚实基础。
业内专家指出,该产能目标涉及逻辑芯片、存储芯片等多类型半导体产品,预计将通过现有厂商扩产与新建生产线相结合的方式推进。作为国内晶圆代工龙头的<中芯国际>和<华虹半导体>等企业,或将在本轮产能扩张中扮演关键角色。
据知情人士透露,中国已制定明确目标,计划到2030年实现新增50万片晶圆月产能的扩张计划。这一战略部署将显著提升国内半导体制造能力,为产业链自主可控奠定坚实基础。
业内专家指出,该产能目标涉及逻辑芯片、存储芯片等多类型半导体产品,预计将通过现有厂商扩产与新建生产线相结合的方式推进。作为国内晶圆代工龙头的<中芯国际>和<华虹半导体>等企业,或将在本轮产能扩张中扮演关键角色。
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