6月30日，天弘科技盘中上涨5.02%，报360.48美元/股，成交额3.11亿美元。
消息面上，OpenAI与博通联合发布首款定制AI推理芯片Jalapeo，Celestica作为核心合作方负责板卡及机架集成配套。该芯片专为大模型推理设计，工程样片已完成实验室验证，计划年底规模化落地，配套千兆瓦级数据中心集群，有望为公司带来可观的增量订单。
此外，公司此前一季度业绩表现强劲，调整后每股收益2.16美元，超市场预期4.35%，营收40.47亿美元亦超预期。叠加与AMD合作推出Helios机柜级AI平台、DS6000系列1.6TbE交换机开放订购等多重利好，公司在AI数据中心基础设施领域的卡位优势持续强化。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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