6月9日，日月光半导体盘中上涨3.04%，报36.788美元/股，成交额3032.63万美元。
消息面上，公司最新披露5月未经审计合并营收达630.3亿新台币（约20亿美元），环比增长1.3%，同比增长29%；其中封装、测试及材料业务营收同比大增38%至421.6亿新台币，显示先进封装需求持续强劲。此外，此前博通AI指引不及预期引发半导体板块连续抛售，日月光从40美元上方一度跌至34美元附近，短期累计跌幅超11%，当前超跌反弹趋势延续。基本面方面，公司一季度净利润同比增长87.02%，先进封装营收目标已上调至35亿美元，AMD百亿美元合作及面板级封装新产线投产预期为中长期增长提供支撑。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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