异动解读|应用材料盘中下跌3.09%,半导体设备板块持续承压叠加美债收益率创新高

行情直击
Aug 28

8月28日,应用材料盘中下跌3.09%,报467.24美元/股,成交额8.51亿美元。半导体设备板块整体延续弱势,拉姆研究跌2.97%、科磊跌3.16%、泰瑞达跌4.06%、AXT跌8.62%,板块呈现普跌格局。

消息面上,市场对AI资本开支持续性产生质疑,叠加30年期美债收益率升至5.31%创新高,融资成本抬升压制高估值科技板块情绪。此外,瑞穗近日下调应用材料及泛林集团目标价,公司高管Brice Hill提交出售10000股限制股声明,期权市场此前亦出现多笔方向性看空大单,机构资金持续押注后续走弱。尽管公司此前财报全面超预期且多家机构维持买入评级,但年内股价已翻倍后市场预期极高,板块短期仍面临估值消化压力。

(以上内容均基于市场公开消息,由程序或算法智能生成,仅作为股价异动提醒,不作为投资建议或交易依据。)

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