On June 3, ASE Technology rose 3.03% in regular trading, trading at $40.235/share, with trading volume of approximately $113 million. The rally was driven by continued catalysts from AMD's massive investment commitment and the company's new advanced packaging capabilities.

On the news front, AMD previously announced an investment exceeding $10 billion into Taiwan's semiconductor and AI industry ecosystem. ASE Technology, as a core outsourced semiconductor assembly and test (OSAT) partner, will co-develop next-generation 2.5D bridge interconnect technology with AMD, directly benefiting from capacity expansion and long-term order expectations. Meanwhile, ASE's subsidiary has developed the industry's first automated 310mm x 310mm panel-level packaging production line, expected to begin production in the first half of next year, further expanding advanced packaging growth potential.

Fundamentally, the company has raised OSAT service prices by 5% to 20%, and its advanced packaging revenue target has been upgraded to $3.5 billion, reflecting sustained business momentum. Within the Semiconductors sector, Marvell Technology rose 8.84%, Intel rose 5.93%, and Broadcom gained 1.03%.

(The above content is based on publicly available market information, generated by a program or algorithm, and is intended solely as a stock movement alert. It does not constitute investment advice or a basis for trading decisions.)