Hubei Dinglong Co.,Ltd. Plans to Expand CMP Soft Polishing Pad Production Line, Focusing on Glass Substrate CMP Pads

Stock News

Jun 08

In an announcement, Hubei Dinglong Co.,Ltd. (ASX: 300054) stated that to capitalize on industry opportunities such as semiconductor industry upgrades, glass substrate technology iteration, and large-diameter substrates, the company aims to solidify its core advantage in semiconductor CMP polishing pads, improve its product portfolio, and enhance long-term operational value and overall competitiveness. Its wholly-owned subsidiary, Hubei Dinglong Huisheng New Materials Co., Ltd., a unit of Hubei Dinghui Microelectronics Materials Co., Ltd., intends to soon initiate the construction project for a third soft polishing pad production line in the Qianjiang industrial park. The project will focus on two high-end product directions: glass substrate CMP polishing pads and large-size (diameter greater than 2 meters) polishing pads. The planned annual production capacity is 300,000 pieces, with a total project investment of 30 million yuan. It is expected to be completed and operational by the end of 2026.

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Plans to Expand CMP Soft Polishing Pad Production Line, Focusing on Glass Substrate CMP Pads\n</h2>\n\n<h4 class=\"meta\">\n\n\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1036600163\">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://community-static.tradeup.com/news/b3bf6d02ad1a6e9e7377eebbb162346a);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">Stock News </p>\n<p class=\"h-time\">2026-06-08 22:54</p>\n</div>\n\n</a>\n\n\n</h4>\n\n</header>\n<article>\n<p>In an announcement, <b>Hubei Dinglong Co.,Ltd.</b> (<b>ASX: 300054</b>) stated that to capitalize on industry opportunities such as semiconductor industry upgrades, glass substrate technology iteration, and large-diameter substrates, the company aims to solidify its core advantage in semiconductor CMP polishing pads, improve its product portfolio, and enhance long-term operational value and overall competitiveness. 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