异动解读|晶合集成盘中上涨3.43%,半导体板块集体反弹叠加超额配售消化顺利

行情直击
Aug 12

8月12日,晶合集成盘中上涨3.43%,报33.24港元/股,成交额318.05万港元。

消息面上,半导体板块集体走强,华虹宏力涨2.1%、中芯国际涨1.53%、兆易创新涨2.86%、澜起科技涨2.74%,行业系统性反弹带动公司股价。同时,公司超额配售的10,886,900股H股于8月11日上市首日即站稳发行价32.30港元上方,显示市场对新增供给消化顺利。此外,公司已于8月7日被纳入港股通标的,GIC、华勤技术等机构近期持续增持,为股价提供资金面支撑。

(以上内容均基于市场公开消息,由程序或算法智能生成,仅作为股价异动提醒,不作为投资建议或交易依据。)

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