7月29日，高通盘后下跌3.11%，报150.01美元/股，成交额4596.97万美元。消息面上，高通于当日盘后发布第三财季财报，市场此前已对成本端压力持续担忧。高通此前正式向客户发出涨价通知，宣布自9月1日起对全系列芯片实施两位数百分比的价格上调，称已无力继续消化上游供应链成本上涨压力。此外，瑞银将高通目标价从235美元大幅下调至190美元，维持中性评级。
尽管同日高通完成对AI软件基础设施公司Modular的收购，且宝马宣布选择高通作为未来十年数字座舱及自动驾驶系统主要芯片供应商，但市场对成本端压力及财报不确定性的担忧占据主导，叠加半导体板块整体承压，股价延续跌势。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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