三星电子芯片部门负责人全:与英伟达黄仁勋探讨HBM4及代工短期合作

美股速递
Jun 08

三星电子芯片部门负责人全永铉近日透露,已与英伟达首席执行官黄仁勋就高带宽内存4(HBM4)及芯片代工领域的短期合作事宜进行了深入讨论。此次会谈聚焦于双方在下一代先进存储技术及半导体制造方面的潜在协作机会,旨在应对当前快速变化的市场需求与技术挑战。

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