消息称台积电2nm晶圆代工价格计划上调50%,高通或将三星列入第二选择

老虎资讯综合
Oct 17

10月17日,台积电计划将2nm晶圆的代工价格上调50%,让高通、联发科等大客户感到为难。业内人士指出,台积电此前将上调N3P工艺代工价格后,高通移动端芯片预计将涨价16%,联发科芯片的售价也将上涨约24%。高通CEO克里斯蒂亚诺・阿蒙在近期表示,在晶圆代工方面会尽可能保留多种选择,虽然英特尔成功量产18A工艺,但这家公司目前还不在选项内。此番言论被业界解读为可能将三星列入“备胎清单”,作为第二选择。 (ChosunBiz)

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