Recently, Amlogic (Shanghai) Co., Ltd. (hereinafter referred to as "Amlogic") announced that the company has submitted an application to The Stock Exchange of Hong Kong Limited for the issuance of overseas-listed shares (H shares) and listing on the Main Board, with relevant application materials published on the Hong Kong Stock Exchange website.
Amlogic stated that submitting the H-share listing application to the Hong Kong Stock Exchange represents an important initiative to expand into international capital markets and enhance brand influence, which is expected to further promote the company's international development process.
Established in 2003, Amlogic became one of the first companies to list on Shanghai Stock Exchange's STAR Market on August 8, 2019. As a globally positioned, domestically leading fabless semiconductor system design manufacturer, the company focuses on the research, development, design, and sales of system-level SoC chips and peripheral chips. Its product portfolio covers multimedia smart terminal SoC chips, wireless connectivity chips, and automotive electronic chips, widely applied in smart homes, automotive electronics, office education, industrial and commercial sectors.
According to Frost & Sullivan reports, based on relevant revenue in 2024, the company ranks fourth globally among manufacturers focused on smart terminal SoC chips, and first in mainland China and second globally in the home smart terminal SoC chip sector.
The prospectus indicates that as of June 30, the company's cumulative chip shipments exceeded 1 billion units. According to Frost & Sullivan data, in 2024, one out of every three smart set-top boxes globally was equipped with the company's smart set-top box chips, and one out of every five smart TVs was equipped with the company's smart TV chips. The company's business spans globally, covering over 250 mainstream global operators, 14 of the world's top 20 TV brands, and numerous AIoT manufacturers and automotive companies.
In terms of performance, Amlogic achieved operating revenues of approximately 5.545 billion yuan, 5.371 billion yuan, 5.926 billion yuan, and 3.33 billion yuan for 2022, 2023, 2024, and the first half of 2025, respectively, with net profits of approximately 732 million yuan, 499 million yuan, 819 million yuan, and 493 million yuan, respectively.
Particularly noteworthy is the company's significant growth momentum in smart home products and wireless connectivity chips. In the first half of 2025, smart home product sales increased by over 50% year-on-year, with Wi-Fi 6 chip sales in the second quarter alone exceeding 1.5 million units, surpassing the entire 2024 full-year level with a quarter-on-quarter increase of over 120%, demonstrating strong product competitiveness and market expansion speed.
As a leading global enterprise in the audio-video system-on-chip (SoC) sector, Amlogic has long maintained a leading position in the smart set-top box and smart TV chip markets, with products widely used in mainstream global consumer electronics brands. The company's overseas business performance is particularly outstanding, with offshore revenue accounting for over 90%, and its customer network covering multiple global regions including North America, Europe, Latin America, Asia-Pacific, and Africa.
Regarding the use of fundraising proceeds, Amlogic mentioned in its prospectus that it plans to use the funds over the next five years to support continued growth and enhance the company's R&D capabilities; build a global customer service system over the next five years; and pursue strategic investments and acquisitions to advance its "platform + ecosystem" strategy. Additionally, the fundraising will be used for general working capital and general corporate purposes.
Industry observers believe that if the H-share issuance in Hong Kong is successfully completed, it will provide support for Amlogic to further expand overseas markets and diversify financing channels, helping to consolidate its global competitiveness in the smart multimedia SoC chip sector.