8月25日，联电盘中上涨4.72%，报19.95美元/股，成交额2591.45万美元。
消息面上，联电迎来双重催化：光子集成电路（PIC）业务加速推进，同时公司正与英特尔合作开发和制造12纳米制程。此前联电已在新加坡厂成功交付首批12吋硅光子量产晶圆，成为全球少数实现12吋PIC代工量产的厂商。执行长王石表示，公司3年内AI相关代工营收将从今年3亿美元提升至10亿美元以上，硅光子为重要增长动能。基本面方面，联电二季度EPS为0.54美元，大幅超出市场预期的0.15美元，产能利用率已达90%以上，董事会已批准约50亿美元资本开支预算用于扩产。行业层面，半导体硅晶圆三年多来首度涨价约10%，AI外溢效应推动成熟制程进入涨价周期。
（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）
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