天域半导体(02658)今日盘中大涨19.05%，引起了市场的广泛关注。
消息面上，据媒体及产业链报道，三星电子已与部分合作伙伴重新讨论碳化硅(SiC)生产所需的新增设备规模，并开始推进供应链建设。业内预计，三星将在2027年完成SiC试验线建设，并于2028年启动规模化量产。这一动向被视为对碳化硅产业链的积极信号。
天域半导体作为中国最大、全球第三大自制碳化硅外延片制造商，其业务与这一趋势高度相关。今年2月，公司已与韩国第三代半导体SiC功率半导体领域的领军企业EYEQ Lab Inc.正式签署战略合作协议，聚焦碳化硅外延片的供应与应用。值得注意的是，EYEQ Lab此前获得了三星子公司Patron的投资，而三星电子内部也已组建新的SiC功率半导体团队，积极拓展相关业务。市场认为，天域半导体有望从三星重启的SiC布局及与韩国伙伴的合作中受益，从而推动了股价的强劲表现。
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