HTSC's "23 Huatai G6" Bond Scheduled for Principal and Interest Payment and Delisting on February 27

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HTSC (06886) has announced that the 2023 corporate bond (fifth issue, series one) issued to professional investors by Huatai Securities Co., Ltd., with the abbreviated name "23 Huatai G6," will undergo principal and interest payment and delisting on February 27, 2026. The bond carries a coupon rate (annual interest rate) of 3.14%, with a principal repayment of RMB 1,000 per lot and interest payment of RMB 31.40 (tax inclusive) per lot.

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